Measured impact on design margin
Design margin is invisible until something is deliberately pushed past its rated limits. HALT finds that margin on a handful of prototypes, early enough that a weak solder joint or an underrated component is a layout change, not a field return.
How we find and widen design margin before production
Two stages make up a HALT and HASS program: finding the limits on a handful of prototypes, and turning what's found into a screen every production unit goes through.
Running HALT on the prototype
- Apply cold, hot, vibration, and combined stresses in step fashion, well beyond the product's rated specification, to find the operating limit and destruct limit at each stress type
- Monitor the unit continuously through each step, since HALT depends on catching the exact point where function degrades, not just where it stops working entirely
- Analyze every failure for its physical mechanism, since the goal of HALT is design weaknesses uncovered, not stress levels recorded
- Feed each finding back into the design as a concrete fix, then retest to confirm the fix actually moved the limit rather than just changed how it failed
Deriving a HASS profile for production
- Set HASS stress levels below the destruct limits found in HALT, high enough to precipitate latent manufacturing defects without consuming the unit's useful life
- Run a proof of screen on known-good and known-defective units to confirm the profile catches real defects without degrading good product
- Define the HASS sample plan, whether that's 100% screening or a defined sample rate, based on the product's risk profile and production volume
- Review HASS results on an ongoing basis, since a rising fallout rate on the line is usually a manufacturing process signal, not a design one
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What defines a design with known margin
A design with known margin isn't one that simply passed its qualification tests. It has documented operating and destruct limits, weaknesses that were found and fixed before formal certification, and a production screen that catches manufacturing defects before they reach the field.
Operating and destruct limits are established against the product's actual duty cycle, not only the levels a standard requires, so the margin found reflects what the product will genuinely encounter in service.
Design weaknesses surface and get corrected before formal qualification testing, when a fix still costs a layout change instead of a failed campaign and a schedule slip.
A HASS profile derived directly from HALT findings screens every production unit for the same latent defects HALT was designed to expose, before they become field returns.
In-house scope vs. accredited laboratory
HALT and HASS work splits the same way vibration and shock work does: design and process decisions on one side, formal accredited testing on the other.
What InTechHouse does in-house
What an accredited laboratory does
HALT stress steps and what each one exposes
Each step records two numbers: the operating limit, where the product's function degrades but recovers once the stress is reduced, and the destruct limit, where it doesn't recover at all. Both get documented for every stress type, since the gap between the operating limit and the product's rated specification is the design margin the whole program exists to find.
Temperature is lowered in steps until the product's function degrades, then further until it fails outright, exposing components and joints that lose margin at low temperature.
The same process run upward, exposing thermal derating issues, parametric drift, and components running closer to their rated limits than the design assumed.
The chamber cycles between temperature extremes at a fast rate of change, exposing solder joints, connectors, and materials with mismatched thermal expansion that a slower cycle wouldn't catch.
Random, six-degree-of-freedom, repetitive-shock vibration excites the assembly broadband and simultaneously across axes, exposing loose fasteners, marginal solder joints, and component mounting that a single-axis test can miss.
Thermal and vibration stresses run together, since some failure modes only appear when both are present at once and never show up when either is tested alone.
Typical failure modes and the design fixes that prevent them
The same handful of failure modes show up across most HALT programs. Each traces back to a specific design decision, and each has a fix that costs far less applied before production than after a field failure.
Symptom: intermittent function during or after thermal cycling, often at a specific joint rather than distributed across the board. Mechanism: repeated expansion and contraction across a joint with a coefficient of thermal expansion mismatch builds up fatigue cracks faster than a slower thermal cycle would reveal.
Fix: reinforce the joint mechanically or select a component package with a better CTE match to the board.
Symptom: the unit stays operational but drifts out of specification at hot or cold step stress, without an outright failure. Mechanism: a component is operating closer to its rated limit than the nominal design assumed, so normal part-to-part variation is enough to push it out of spec under stress.
Fix: reselect the component for wider margin, or add compensation in the design that accounts for the drift.
Symptom: a failure that only appears during the combined environment step, not during thermal or vibration alone. Mechanism: thermal expansion changes contact pressure at a connector interface already loosened by vibration, and neither stress alone opens the gap far enough to fail.
Fix: specify a locking or higher-retention-force connector and add strain relief at the cable side.
Symptom: units pass functional test on the line but fail during HASS screening, or shortly after installation. Mechanism: a manufacturing variation, such as a marginal solder joint or a component with a hidden defect, doesn't affect function until stress accelerates the failure.
Fix: feed the HASS finding back to the production process, since this is usually a workmanship or component-lot issue rather than a design one.
Use Cases
Industries We Serve
Our engineering capabilities are deployed across regulated, mission-critical and industrial sectors.
Subsea electronics, downhole systems and harsh-environment hardware for offshore and onshore operations.
Mission-critical embedded systems and real-time firmware for UAV platforms and defence electronics.
Real-time embedded firmware for gas detection, environmental sensing and worker alert systems.
Embedded systems and real-time firmware for industrial automation,
machine control and IoT data acquisition.
Technologies we use
The reliability engineering disciplines applied on every HALT and HASS program, from prototype stress testing through the production screen it produces.
FAQs
If you have additional questions or would like to discuss your requirements, feel free to get in touch with our team.
Highly Accelerated Life Testing (HALT) applies extreme environmental conditions, extreme temperatures, and random vibration, well beyond a product's normal operating conditions, to identify weaknesses fast. Unlike a test built to replicate real world conditions, HALT deliberately goes past them, exposing products to accelerated stresses that reveal design defects, weak points, and potential failure points long before they'd show up in the field. The goal is finding product weaknesses and design flaws early enough to fix the root cause and improve product reliability and product durability, not simulating actual use.
HALT runs on a small number of prototypes early in development to find design weaknesses and establish operating and destruct limits. Highly Accelerated Stress Screening (HASS) runs later, as a screening process applied to the finished product during manufacturing, applying stresses below the destruct limits HALT found to screen components such as power supplies and connectors for latent defects and manufacturing variation before units reach the customer. The key differences come down to timing and purpose: HALT precedes HASS, and the two form a feedback loop between design and the production process that produces more reliable products.
No. HALT stress levels are deliberately set beyond normal operating limits to precipitate failures quickly, so the point at which a failure occurs under these stress conditions doesn't map to a mean time between failures under actual use. HALT identifies design weaknesses and quantifies margin under accelerated conditions; it isn't a life test and shouldn't be used to estimate product life cycle or field reliability numbers.
Environmental Stress Screening is the broader, older category of production screening using thermal cycling and vibration to catch manufacturing defects. HASS is a specific, more efficient approach to ESS: its stress levels come directly from HALT results rather than a generic profile, and a proof of screen confirms the profile precipitates real defects without over-stressing good units. Both aim to catch early failure in the infant mortality region of a product's life, before a defect that would fail quickly in the field ships and affects product quality.
Cold step stress and hot step stress push the product through cold temperatures and extreme temperatures well past its rating, rapid thermal cycling stresses solder joints and materials with a fast rate of change, and random six-degree-of-freedom vibration step stress runs until the vibration destruct limit is found. A combined environment step runs thermal and vibration together, layering these environmental factors since some failure modes only appear under combined stresses.
HASS stress levels are set below the operating and destruct limits established in HALT, high enough to precipitate latent defects without consuming useful product life. Functional testing runs continuously during the screening process, using the same test fixtures and monitoring approach validated in HALT, and a proof of screen confirms the profile against known-good and known-defective units before it's applied to full production.
As early as functional prototypes exist, ideally in the early stages of the design phase, before the design is locked for formal qualification testing. Running the HALT process at that point lets a team optimize designs and build in a more robust design before anything is tooled. Findings at that stage are layout changes and lower product development costs; the same findings after tooling or certification testing is underway are costly mistakes and schedule problems, since fixing them raises product development costs significantly.
When there's no realistic ability to act on what it finds, such as a one-off build, a mature product with a clean field history, or a program with no schedule or budget left for design changes. For medical devices, defense systems, or other high reliability applications, that calculus rarely applies, since the cost of a field failure usually outweighs the cost of finding the same weakness on a prototype.
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