Best practices every design engineer needs for PCB and hardware creation
Hardware and PCB design is a process that requires not only advanced technical knowledge but also a strategic approach to optimizing performance, reliability, and production costs. “Failing to follow proper design guidelines can lead to costly revisions and performance issues. The best engineers know that rigorous testing and iterative design are non-negotiable.” — underlines Dr. Alan Hayes, Electrical Engineering Professor.
Designing modern and functional devices requires applying proven methodologies to minimize errors and streamline implementation. To ensure a smooth development process, consider these best practices:
- Early collaboration – hardware and PCB designers should communicate throughout the development process to prevent design conflicts;
- Use of simulation tools – tools like SPICE, SI/PI simulators, and 3D modeling can detect design flaws before manufacturing;
- Standardized design guidelines – adhering to industry standards such as IPC-2221 (PCB design) and IPC-7351 (component footprint design) improves reliability;
- Iterative prototyping – using rapid prototyping techniques such as PCB milling or 3D printing for mechanical verification speeds up development;
- Compliance and testing – ensuring that the design meets EMC, ESD (Electrostatic Discharge), and other regulatory requirements. Using proper grounding techniques, shielding, and controlled impedance routing reduces electromagnetic interference and compliance failures;
- Power integrity considerations – proper power distribution network (PDN) design, decoupling capacitors placement, and voltage regulation help maintain signal integrity and reduce noise;
- Design for Manufacturability (DFM) – following DFM principles, such as adequate trace width, via sizes, and component spacing, minimizes production issues and improves yield. According to a survey by IPC found that companies that implement Design for Manufacturability (DFM) principles reduce production costs by up to 30% and experience 50% fewer defects in mass production.
- Design for Testability (DFT) – including test points, boundary scan (JTAG), and accessible debugging interfaces simplifies troubleshooting and validation;
- Version control and documentation – maintaining up-to-date schematics, BOMs (Bill of Materials), and revision control prevents miscommunication and ensures reproducibility;
- Signal integrity optimization – high-speed design techniques, such as differential pair routing and controlled impedance traces, prevent data corruption and signal degradation;
- Component lifecycle management – choosing components with long availability and second-source options reduces risks of obsolescence and redesign.